ODA-132MH(210)

Core advantages

  • Apply 210mm large silicon wafer technology and half module technology

  • Multi-busbar (MBB) technology is applied to effectively improve optical utilization and reduce internal current consumption

  • Apply innovative non-destructive cutting technology to reduce the risk of cracking

  • Industry standard anti-PID (potential induced decay) by TUV North Germany

650-670W

210*105mm

Common problem

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